India’s semiconductor journey is set to reach a historic milestone as a Mysuru-based electronics manufacturing company gears up to deliver the nation’s first packaged chip under the India Semiconductor Mission 1.0 by July this year. The development positions the company as a pioneering force in India’s ambitions to become a self-reliant semiconductor hub.
The company has already signed definitive multi-year agreements with major customers to supply packaged chips. In the first phase alone, they aim to produce approximately 6.3 million chips annually—covering over 60% of their total capacity. This is made possible through a newly approved OSAT (Outsourced Semiconductor Assembly and Test) facility located in Sanand, Gujarat, with a capital outlay of ₹3,300 crore.
This advanced facility will be operational by June and begin evaluating production batches by July and August. The chips produced at this plant will support various technologies including silicon carbide-based power transistors (SiC), IGBTs, and low-power MOSFETs, with a roadmap to expand into logic and memory packaging.
As part of its broader goal, the company is also developing plans to deliver packaging solutions for 12 different semiconductor applications. The initiative is expected to boost the domestic electronics manufacturing ecosystem while reducing dependency on imports.
With its aggressive production timeline and robust investment, this chipmaker is playing a key role in India’s strategic push for semiconductor independence—setting the stage for a future where the country becomes a formidable player in the global chip supply chain.